Yun Sun1,2,3, Yong Xu1,3, Helin Li1, Yongshan Liu1,3, Fan Zhang1,3, Houyi Cheng1,3, Shina Tao5, Huacai Wang5, Wei Hu5, Yanqing Lu5, Chao Zhao1, Tianxiao Nie1,2,3*, Weisheng Zhao1,2,3*, Qi Guo4* and Lianggong Wen1,2*
北航温良恭副研究员、郭琦副教授、赵巍胜教授、聂天晓教授
1 School of Integrated Circuit Science and Engineering, Beihang University, Beijing, 100191, China
2 Beihang Hangzhou Innovation Institute Yuhang, Beihang University, Hangzhou, 310023, China
3 Hefei Innovation Research Institute, Beihang University, Hefei 230013, China
4 School of Instrumentation and Optoelectronic Engineering, Beihang University, Beijing 100191, China
5 Nanjing University, College of Engineering and Applied Sciences, National Laboratory of Solid State Microstructures, Key Laboratory of Intelligent Optical Sensing and Manipulation, Collaborative Innovation Center of Advanced Microstructures, Nanjing, China
