Xinyi Li1,7, Jianshi Tang1,2,7, Qingtian Zhang1,7, Bin Gao1,2, J. Joshua Yang3, Sen Song4, Wei Wu1, Wenqiang Zhang1, Peng Yao1, Ning Deng1,2, Lei Deng5, Yuan Xie5,6, He Qian1,2 and Huaqiang Wu1,2✉
清华大学吴华强教授
1 Institute of Microelectronics, Beijing Innovation Center for Future Chips (ICFC), Tsinghua University, Beijing, China.
2 Beijing National Research Center for Information Science and Technology (BNRist), Tsinghua University, Beijing, China.
3 Department of Electrical and Computer Engineering, University of Massachusetts, Amherst, MA, USA.
4 Department of Biomedical Engineering, School of Medicine, Tsinghua University, Beijing, China.
5 Department of Electrical and Computer Engineering, University of California at Santa Barbara, Santa Barbara, CA, USA.
6 Alibaba DAMO Academy, Hangzhou, China.
7 These authors contributed equally: Xinyi Li, Jianshi Tang, Qingtian Zhang.