Peng Yao1, Huaqiang Wu1,2*, Bin Gao1,2, Jianshi Tang1,2, Qingtian Zhang1, Wenqiang Zhang1, J. Joshua Yang3 & He Qian1,2
清华大学吴华强教授
1 Institute of Microelectronics, Beijing Innovation Center for Future Chips (ICFC), Tsinghua University, Beijing, China.
2 Beijing National Research Center for Information Science and Technology (BNRist), Tsinghua University, Beijing, China.
3 Department of Electrical and Computer Engineering, University of Massachusetts, Amherst, MA, USA.